JPH0159072B2 - - Google Patents
Info
- Publication number
- JPH0159072B2 JPH0159072B2 JP17867281A JP17867281A JPH0159072B2 JP H0159072 B2 JPH0159072 B2 JP H0159072B2 JP 17867281 A JP17867281 A JP 17867281A JP 17867281 A JP17867281 A JP 17867281A JP H0159072 B2 JPH0159072 B2 JP H0159072B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- soldering
- guide
- jig
- conveyor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 238000005476 soldering Methods 0.000 claims description 35
- 238000004140 cleaning Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000005587 bubbling Effects 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 description 21
- 229910000831 Steel Inorganic materials 0.000 description 15
- 239000010959 steel Substances 0.000 description 15
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000007664 blowing Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17867281A JPS5881555A (ja) | 1981-11-06 | 1981-11-06 | 自動はんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17867281A JPS5881555A (ja) | 1981-11-06 | 1981-11-06 | 自動はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5881555A JPS5881555A (ja) | 1983-05-16 |
| JPH0159072B2 true JPH0159072B2 (en]) | 1989-12-14 |
Family
ID=16052540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17867281A Granted JPS5881555A (ja) | 1981-11-06 | 1981-11-06 | 自動はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881555A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5997761A (ja) * | 1982-11-29 | 1984-06-05 | Tamura Seisakusho Co Ltd | 自動はんだ付け装置 |
| JPS61111667U (en]) * | 1984-12-26 | 1986-07-15 |
-
1981
- 1981-11-06 JP JP17867281A patent/JPS5881555A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5881555A (ja) | 1983-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI313894B (en) | Apparatus and method for substrate processing | |
| US4801069A (en) | Method and apparatus for solder deposition | |
| TW201539629A (zh) | 基板處理裝置及抗蝕層剝離裝置 | |
| KR940008779A (ko) | 원판형 기록매체의 주물을 제조하는 장치 | |
| US12124169B2 (en) | Nozzle standby port, apparatus for treating substrate including the same and method for cleaning nozzle using the same | |
| KR100477013B1 (ko) | 처리 장치와 그 방법 및 로봇 장치 | |
| JP3085097B2 (ja) | スクリーンマスクの洗浄装置 | |
| JPH0159072B2 (en]) | ||
| JPH07111963B2 (ja) | 基板の洗浄乾燥装置 | |
| JP4332867B2 (ja) | ウェーハの支持装置及び該装置を備えた移送装置 | |
| US4802276A (en) | Apparatus for printed wiring board component assembly | |
| JP3193327B2 (ja) | 洗浄装置 | |
| JPS5857270B2 (ja) | 被はんだ付け物移換え装置 | |
| JPS5857269B2 (ja) | 被はんだ付け物整列支持用の治具 | |
| JP3448602B2 (ja) | ディスク用カセットの洗浄装置 | |
| US4682563A (en) | Jig for supporting array of articles to be soldered and device for transferring articles to jig | |
| JP2971681B2 (ja) | 処理装置 | |
| JPS59134834A (ja) | 半導体ウエハの洗浄装置 | |
| JP2000111254A (ja) | ディスク用カセットの乾燥装置 | |
| JPH10335425A (ja) | ウェハ移し替え装置 | |
| JP4043039B2 (ja) | 現像方法及び現像装置 | |
| JP3179571B2 (ja) | ウェハ貼付プレートの洗浄および移送装置 | |
| JPS5997761A (ja) | 自動はんだ付け装置 | |
| JPS6316907B2 (en]) | ||
| JPH05299572A (ja) | リードフレームの洗浄および乾燥装置 |